Through 11 years of COB integrated packaging technology practice activities, we have deeply realized that the most important significance of practicing COB integrated packaging is not only to use it to make COB small-pitch and micro-pitch display products, but also to use scientific methods to find The influence of the number of pins of the device-type package device on the overall reliability of the LED display system is explained. Through reverse thinking, starting from the small, usually ignored bracket pins, we constructed a comparison, analysis and critical model of traditional packaging technology and COB integrated packaging technology, and then found the key to solving the biggest pain point in the industry, that is, proposing The best way to solve the problem of too many pixel failures in LED displays is to remove the pins from the packaging technology. Promoting the industrialization and popularization of bracket-free pin-free integrated packaging technology is the first step in transforming industry-wide industrial technology from low-level manufacturing to mid-level manufacturing. Continuing this direction of efforts, further in-depth research on bracket-free integrated packaging technology is to gradually realize the comprehensive transition from device-level pin welding technology to chip-level pin welding technology, which will drive chip technology, process technology, and testing technology. , repair technology, sealing technology, conversion technology, material technology, and equipment technology have greatly improved, making a qualitative leap in the overall reliability of the LED display system, and finally realizing and mastering the high-end manufacturing technology of LED display panels, which is far more significant than Using COB integrated packaging to make Mini LED products is a much larger market segment.