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2024: BPIPack technology emerges and moves towards a new era of bracket-free and pinless integrated packaging

Time:2024-01-02 Preview:0

In 2024, we ushered in the first day of work, which also marked the beginning of a crucial year for the development of bracket-free lead-free integrated packaging technology. In this critical 10-year period of industrial transformation, one-third of the time has passed. New technologies are changing every moment, and the results achieved are encouraging. In the LED direct display industry, micro-pitch display products pioneered by integrated COB technology are setting a benchmark for BPIPack technology and will be widely recognized at an astonishing speed. This year, we are confident that we will see more special discussions on related technologies, opening a new chapter for the scale of industrial development of new system technologies.

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News from the performance list: Integrated COB micro-pitch

Display product industry scale grows strongly

The rise of BPIPack technology is a highlight in the current LED direct display industry and semiconductor industry. Bracketless leadless integrated packaging technology enables higher performance and smaller size chip design by introducing packaging materials directly into the chip. The development of this technology not only improves the performance of semiconductor equipment, but also promotes innovation and progress in the entire industry.

In the new year, we predict that BPIPack technology will usher in greater breakthroughs and continue to expand new application areas. Whether in the LED direct display industry, LCD backlight panel industry, driver IC packaging industry, or smartphones, Internet of Things equipment, and artificial intelligence fields, BPIPack technology will play an increasingly important role. The popularization of this technology will bring new possibilities to product design and manufacturing, and push the industry to a higher level.

At the same time, we also see the new system technology industry developing strongly throughout the industry. With the popularization of bracket-free lead-free integrated packaging technology, the entire industry will undergo tremendous changes. This year, we look forward to seeing more technology companies emerge to promote innovation in new system technologies and inject new vitality into the sustainable development of the industry.

Finally, let us look forward to this year’s blessings for the LED direct display industry. We hope that the widespread application of BPIPack technology will bring us more efficient, smarter, and more diversified application display devices, while also driving the prosperity and development of the entire industry. In the new year, let us work together to witness the glorious moment of bracket-free leadless integrated packaging technology and welcome the vigorous development of the new system technology industry.

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